MIL-PRF-23419/12E
NOTES:
1. Voids greater than .020 inch (0.51 mm) diameter are rejectable.
2. Voids in the lead egress area, which are greater than 50 percent of the distance between the case bottom
and the bottom of the alumina substrate, are rejectable.
3. Voids extending the full length between the terminals are rejectable.
4. Pin holes greater than .010 inch (0.25 mm) diameter in the arc suppressant glass are rejectable.
5. Foreign material greater than .015 inch (0.38 mm) diameter between terminals or bordering edge of the
alumina substrate are rejectable.
6. Cracks in the alumina substrate are rejectable.
7. Cracks in the molded case are rejectable.
8. Solder fillets are defined as that area along the side of each terminal and is not inclusive of the the soldered
area immediately under the terminal. The "Solder Fillet Voids > .015 Dia." shall apply to that portion of the
solder void that can be viewed in an area extending beyond the side of the terminal.
9. Solder voids found under the terminal shall be cause for rejection if the sum of voids is exceeds 50% of the
solderable area under the terminal.
FIGURE 8. Reject criteria (radiographic inspection).
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